IC 設計與先進封裝

A comprehensive approach to IC design innovation combines integrated project management, cross-domain collaboration and digital twin technology to accelerate semiconductor development and unlock new business opportunities. Our solution helps you:

• Drive faster development cycles through real-time collaboration across product teams, quality, process engineering and manufacturing in a semiconductor-specific environment.
• Leverage digital twin technology to optimize designs from chip-level through advanced IC, enabling seamless integration from specification to fabrication.
• Embed sustainability early in product design to significantly reduce environmental impact while meeting performance goals.
• Streamline NPI success with automated project management templates, out-of-the-box metrics, and unified program delivery platforms.

Empower your business with a comprehensive approach to 3D IC design that tackles the increasing complexities of heterogeneous packaging while unlocking greater functionality. Here's how our integrated solution advances your success:

• Streamline ASIC and chipset integration through an accessible, scalable solution that reduces dependency on specialized expertise.
• Ensure digital continuity through unified data models that enable efficient design and predictive analysis.
• Implement strategies that capitalize on 3D IC form factor advantages while managing manufacturing complexity.
• Adopting a modular approach enhances performance and significantly reduces development costs and time-to-market for semiconductor products.

Adopting a comprehensive approach to semiconductor manufacturing that combines early planning integration, yield optimization, and end-to-end traceability. You can minimize manufacturing issues and accelerate production readiness, ensuring high yields in today's complex manufacturing environment. The key benefits of our manufacturing-focused solution include:

• Address manufacturing challenges early in the design phase through streamlined DFT, compression, and ATPG optimization that aligns with foundry requirements.
• Ensure production readiness by connecting all digital and physical assets in one efficient data and process model, from die design through bill of process.
• Strengthen security and quality control through comprehensive traceability that prevents disruptions, counterfeits, and potential security breaches.